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E6E11:What is a characteristic of DIP packaging used for integrated circuits?

E6E11E6E

What is a characteristic of DIP packaging used for integrated circuits?

Direct answer summary (2024-2028 NCVEC pool)

The official correct answer for E6E11 is Two rows of connecting pins on opposite sides of package (dual in-line package).

The key fact is Two rows of connecting pins on opposite sides of package (dual in-line package). Match that fact to the exact condition in the question; the other choices describe a different rule, band, component, or operating situation.

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